Lab Services
Co-Design & Simulation
- MEMS & IC design
- Photomask layout
- Linear & non-linear finite element analysis
- Multiphysics analysis
- Statistical distributions of process parameters
Advanced Packaging & Assembly
- Wafer dicing
- Plasma cleaning
- Die attach & die stacking
- Flip chip
- Aluminum wedge bonding
- Gold ball bonding
- Gold stud bumping
- Encapsulation, potting & underfill
- Epoxy lid sealing
Reliability Testing
- Thermal & humidity cycling
- Air-to-air thermal shock
- Highly accelerated stress test
- High temperature storage
- Super accelerated UV weathering
- Vibration testing
- Shear & pull testing
Inspection & Characterization
- Probe testing
- Thin film metrology
- Film stress analysis
- Infrared & near infrared imaging
- Optical inspection
- Acoustic microscopy
- Surface profiling — contact & non-contact
Wafer-Level Processing
- Photolithography
- Plasma enhanced CVD
- Deep reactive ion etching
- Sputtering
- Wafer bonding
- Wafer bumping
- Wafer thinning
Spectre Corp would like to highlight the upcoming SiC (Silicon Carbide) Sensor!
